Plating process chemicals for MID (Molded Interconnect Devices)
MID process chemicals with reliable selectivity (copper, nickel, tin, silver, gold finishes available)
Japan McDermid proposes a new MID plating process that offers high yield and reliable selectivity, making it ideal for plating LDS, Pd-containing resins, and double-shot MID. This process provides stable selectivity across a wide range of materials and catalysts, enabling more complex and efficient designs for the most needed low-cost molded composites. Additionally, the simple and manageable process results in stable plating rates and a long, predictable bath life.
- Company：マクダーミッド・パフォーマンス・ソリューションズ・ジャパン 本社
- Price：Other
